logo

TSMC successfully negotiates price: News reports that its first High NA EUV lithography machine is far below ASML's offer of 350 million euros

IT Home  On September 10th, following Intel's announcement in April 2024 that it had completed the assembly of the industry's first High NA EUV lithography machine, TSMC's Hsinchu Science Park will introduce its first High NA EUV lithography machine by the end of September, one quarter earlier than the estimated end of the yearDigitimes reported that the purchase price of TSMC's first High NA EUV equipment was much lower than the original offer of 350 million euros (IT Home notes: currently about 2.755 billion yuan)It is reported that TSMC can enjoy discounts mainly because; ASML has made significant concessions (after all, TSMC is a super VIP), fully assisting TSMC in machine installation, calibration, and technical support to accelerate the launch time, which is mainly for TSMC's trial use. ASML stated that they do not comment on individual customers

The supply chain stated that as the future 3nm production capacity is fully loaded and customer orders for the 2nm process expected to be mass-produced in Q4 2025 are gradually falling into the bag, TSMC has restarted the EUV equipment hauling momentum, and it is estimated that the scale of this wave of new orders will reach about 70 unitsTSMC currently holds an absolute market share advantage and discourse power, and is also the customer with the highest order volume for EUV equipment to date. In addition, TSMC is the largest customer for High NA EUV, making it clear that TSMC has a bargaining advantage with ASML